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HAD810
    发布时间: 2019-06-29 16:20    


HAD810(全自动平面固晶机)

(周期: 220ms

适用于IC类框架

一、机型特性

1.直线电机驱动的双点胶系统;

2.高精度直线驱动固晶绑头,音圈扭力环精确控制固晶压力;

3.高精度搜寻芯片平台,伺服电机驱动芯片角度矫正系统,配备自动扩膜系统;

4.采用点胶独立控制系统,胶量控制更加精确;

5.采用真空漏晶检测;

6.工控机控制设备运行,简化了自动化设备的操作;

7.精准的自动化设备为企业提高生产效率,降低成本提供了有效保障,从而切实有效地提高了企业竞争力;

 

HAD810

Automatic Plane-type Die Bonder

Cycle: 220ms

It is compatible with IC frame

 

1.        Linear motor is applied to drive double adhesive dispensing bond head;

2.        High precision linear driving die bond tieback, voice coil torsion loop controls die bond pressure accurately;

3.        High-precision die platform searching, servo motor driving die angle correction system, equipped with automatic film expansion system;

4.        A separate dispensing control system is adopted to make a precisely control of dispensing amount;

5.        Vacuum die missing testing technology is adopted;

6.        IPC will control the operation of equipment, simplifying the operation of automation equipment;

7.        Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance your enterprise’s competitiveness.

二、规格参数

Specifications and Parameters

1.系统功能/System Function

4、吸晶摆臂机械手系统/

Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

220ms(取决于芯片与支架)(Depending On Die Size And Holder)

吸晶摆臂

/Die Bonder’s Swing Arm

150mm 直线电机往复固/linear motor reciprocate die bonding

XY位置精度/Accuracy

±0.6mil(±0.015mm

吸晶压力

/Die Bond Pressure

可调20g—250g(Adjustable)

不作上视式检查Accuracy (Up-look inspection)

±1mil(±0.025mm

5.适用支架尺寸/Suitable Holder’s Size

芯片旋转/Die Rotation

±1°

2.芯片XY工作台/Die XY Workbench

支架长度/Length

110mm ~ 280mm

芯片尺寸/Die Dimensions

5mil×5mil-100mil×100mil
(0.13mm*0.13mm-2.54mm*2.54mm)

小于12mil芯片需考虑胶杯沾胶

(Consider the glue disk dispensing way if the die is lesser than 12mil)

支架宽度/Width

25mm ~ 110mm

晶片最大角度修正/

Max. Angle Correction

360°

6.所需设施/Facilities Needed

适用芯片环尺寸/

Max. Die Ring Size

外径(External Diameter):296mm   内径(Inner Diameter)254mm

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

最大芯片面积尺寸

/Max. Die Area

直径205mm(扩张后)(Expanded)

压缩空气/Compressed Air

0.5MPaMIN

分辨率/Resolution Ratio

0.04mil  (1μm)

额定功率/Rated Power

1820W

顶针Z高度行程/Thimble Z Height Stroke

80mil2mm

耗气量/Gas Consumption

5L/min

适用铁环/晶圆

Suitable Iron ring/ wafer

标配 10寸铁环8寸晶圆/Standard Equipped with 10Iron Ring and 8Wafer

可兼容 8寸铁环6寸晶圆/Compatible with 8Iron Ring and 6Wafer

3.图像识别系统/Image Recognition System

适用针筒规格

Suitable Barrel Spec.

标配10CC(可兼容5CC3CC) /Standard Equipped with 10CC, (Compatible with 5CCand 3CC)

灰阶度/Grey Scale

256级灰度(Level Grey)

7.体积及重量/Volume and Weight

分辨率/Resolution

656×492像素(Pixels)

xx/

Length x Width x Height

205×135×190cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

1800kg




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