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HAD308
    发布时间: 2019-06-30 16:55    


HAD308(平面式高速固晶机)

(周期:80ms

适用于普通贴片,COB, 二极管,三极管,倒装支架等

一、机型特性

1.采用国际领先的双固晶,双点胶,双晶片搜寻系统;

2.采用直驱电机驱动邦头

3.采用线性电机驱动搜寻晶片平台(X/Y)与送料平台(B/C

4. 晶框采用自动角度修正系统;

5.采用可程式恒温点胶系统;

6.采用真空漏晶检测;

7.采用免装料盒上料方式,具备吸纸功能(能够剔除框架隔离纸),有效提高了生产效率;

8.工控机控制设备运行,简化了自动化设备的操作;

9.精准的自动化设备为企业提高生产效率,降低成本提供了有效保障,从而切实有效地提高了企业竞争力;

10. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障

 

HAD308

Plane-type High-speed Die Bonder

Cycle: 80ms

It is compatible with SMDCOB diodeaudionflip-chip etc. 

1.      International leading double die bond, double adhesive dispensing and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Crystal frame automatic correction chip structure is also applied

5.      Programmed control constant-temperature adhesive dispensing system is also applied;

6.      Vacuum die missing testing technology is adopted;

7.      Loading by free-loading magazine with paper suction function (eliminate the frame release paper), to largely improve the production efficiency;

8.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

9.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

10.  Precise die bond location and excellent compatibility will guarantee the back-end processing.



二、规格参数

Specifications and Parameters

1.系统功能/System Function

4、吸晶摆臂机械手系统/

Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

220ms(取决于芯片与支架)(Depending On Die Size And Holder)

吸晶摆臂

/Die Bonder’s Swing Arm

150mm 直线电机往复固/linear motor reciprocate die bonding

XY位置精度/Accuracy

±0.6mil(±0.015mm

吸晶压力

/Die Bond Pressure

可调20g—250g(Adjustable)

不作上视式检查Accuracy (Up-look inspection)

±1mil(±0.025mm

5.适用支架尺寸/Suitable Holder’s Size

芯片旋转/Die Rotation

±1°

2.芯片XY工作台/Die XY Workbench

支架长度/Length

110mm ~ 280mm

芯片尺寸/Die Dimensions

5mil×5mil-100mil×100mil
(0.13mm*0.13mm-2.54mm*2.54mm)

小于12mil芯片需考虑胶杯沾胶

(Consider the glue disk dispensing way if the die is lesser than 12mil)

支架宽度/Width

25mm ~ 110mm

晶片最大角度修正/

Max. Angle Correction

360°

6.所需设施/Facilities Needed

适用芯片环尺寸/

Max. Die Ring Size

外径(External Diameter):296mm   内径(Inner Diameter)254mm

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

最大芯片面积尺寸

/Max. Die Area

直径205mm(扩张后)(Expanded)

压缩空气/Compressed Air

0.5MPaMIN

分辨率/Resolution Ratio

0.04mil  (1μm)

额定功率/Rated Power

1820W

顶针Z高度行程/Thimble Z Height Stroke

80mil2mm

耗气量/Gas Consumption

5L/min

适用铁环/晶圆

Suitable Iron ring/ wafer

标配 10寸铁环8寸晶圆/Standard Equipped with 10Iron Ring and 8Wafer

可兼容 8寸铁环6寸晶圆/Compatible with 8Iron Ring and 6Wafer

3.图像识别系统/Image Recognition System

适用针筒规格

Suitable Barrel Spec.

标配10CC(可兼容5CC3CC) /Standard Equipped with 10CC, (Compatible with 5CCand 3CC)

灰阶度/Grey Scale

256级灰度(Level Grey)

7.体积及重量/Volume and Weight

分辨率/Resolution

656×492像素(Pixels)

xx/

Length x Width x Height

205×135×190cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

1800kg




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