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HAD826PW-M
    发布时间: 2019-06-30 16:55    


HAD826PW-M(三头平面式高速固晶机)

(单头周期:300ms


一、机型特性

1.  采用直驱电机驱动邦头

2.  采用线性电机驱动搜寻晶片平台(X/Y)与送料平台(B/C

3.  采用可程式恒温双点胶系统;

4.  采用真空漏晶检测;

5.  采用自动式上下料,减少换料时间;

6.  工控机控制设备运行,简化了自动化设备的操作;

7.  精准的设备化设备为企业提高生产效率,降低成本提供了有效保障,从而切实有效地提高了企业竞争力;

8.  精准的固晶位置及优良的一致性为后道工序提供了先天的保障,同时固晶位置精准确保LED灯光斑的品质,良好焊接及漂亮光斑再加上优良晶片就构成了高品质LED产品。

 

HAD826PW-M

Triple-head Plane-type High-speed Die Bonder

Single Head Cycle: 300ms

It is compatible with flip-chip PCB.

 

Product Features

1.      Linear motor is applied to drive bond head;

2.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

3.      Programmed control constant-temperature double adhesive dispensing system is also applied;

4.      Vacuum die missing testing technology is adopted;

5.      Automatic loading and unloading system is applied to saving the time of reloading;

6.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

7.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

8.      Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED lamp spot; thus, high-quality LED products will be created with excellent welding, elegant light spot and choiceness dies.

 

二、规格参数

Specifications and Parameters

1.系统功能/System Function

4、吸晶摆臂机械手系统/

Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

300ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶摆臂/Swing Arm of Die Bonder

130°可旋转固晶(Rotatable Die Bond)

XY精度/Accuracy

±0.8mil(±0.02mm

吸晶压力/Die Bond Pressure

可调20g250g(Adjustable)

芯片旋转/Die Rotation

±3°

5.送料工作平台/Loading Workbench

2.芯片XY工作台/Die XY Workbench

行程范围/Range of Stroke

260mm*200mm

芯片尺寸/Die Dimensions

3mil×3mil-80mil×80mil
(0.1mm*0.1mm-2mm*2mm)

XY分辨率/XY Resolution

0.02mil0.5μm

6.适用支架尺寸/Suitable Holder’s Size

晶片最大角度修正/Max. Angle Correction

 ±30°

支架长度/Length

170-260mm

最大芯片环尺寸/Max. Die Ring Size

6″(152mm)外径(External Diameter)

支架宽度/Width

80-200mm

最大芯片面积尺寸/Max. Die Area

4.7″(119mm)扩张后(Expanded)

7.所需设施/Facilities Needed

分辨率/Resolution Ratio

0.04mil  (1μm)

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

顶针Z高度行程/Thimble Z Height Stroke

80mil2mm

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

1819W

3.图像识别系统/Image Recognition System

耗气量/Gas Consumption

5L/min

灰阶度/Grey Scale

256级灰度(Level Grey)

8.体积及重量/Volume and Weight

分辨率/Resolution

656×492像素(Pixels)

xx/

Length x Width x Height

332×125×210cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

2000kg

 

 





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