公司理念:创新、高效、和谐、务实
|
|
|
|
|
|
|

0755-27502933 

产品服务
PRODUCT  service
 
产品分类
HAD826P
    发布时间: 2019-06-29 15:59    


HAD826P(平面式高速固晶机)

(周期:140ms

适用于倒装、COBSMD352821215050等各类支架

一、机型特性

1.平面式LED灯全自动固晶的最佳选择;

2.高速固晶(140ms/颗,每小时产量为25K)、精准的自动化设备为企业提高生产效率、降低成本提供了有效保障,从而切实有效地提高了企业竞争力;

3.精准的固晶位置及优良的一致性为后道工序提供了先天的保障;

4.吸抓一体和料盒推支架两种方式兼容进料,可循环式料盒收料;同时采用左进料和右收料的方式,方便操作人员操作机台;


6.采用全新接触式深测系统控制摆臂;

7.线性电机驱动晶片搜寻平台(X/Y)与固晶平台(B/C

8.采用可程式恒温点胶系统;

9.采用真空漏晶检测;

10. 工控机控制设备运行,简化了自动化设备的操作;

 

 

HAD826P

Plane-type High-speed Die Bonder

Cycle: 140ms

It is compatible with flip-chipCOBSMD35282121 and 5050 etc. types of holders

 

Product Features

1.        It is the best choice for full-automation die bond of planar LED lights;

2.        High-speed die bond(140ms/ piece, 25K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

3.        Precise die bond location and excellent compatibility will guarantee the back-end processing;

4.        Two ways of suction and grasping united and the magazine push holders are compatible to load, and receiving by the circulating magazine; meanwhile, the left loading and right receiving method made it convenient to operate;

5.        Linear motor is applied to drive bond head;

6.  New deep contact measurement system control arm is applied;

7.        Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

8.        Brand-new constant-temperature adhesive dispensing system is also applied;

9.        Vacuum die missing testing technology is adopted;

10.    IPC will control the operation of equipment, simplifying the usage of automation equipment.

二、规格参数

Specifications and Parameters

 

1.系统功能/System Function

4、吸晶摆臂机械手系统/

Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

140ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶摆臂/Swing Arm of Die Bonder

90°可旋转固晶(Rotatable Die Bond)

XY位置精度/Accuracy

±1mil(±0.025mm

吸晶压力/Die Bond Pressure

可调20g250g(Adjustable)

芯片旋转/Die Rotation

±3°

5.送料工作平台/Loading Workbench

2.芯片XY工作台/Die XY Workbench

行程范围/Range of Stroke

支架长/Length130mm-260mm.

支架宽/Width50mm-130mm.

芯片尺寸

/Die Dimensions

5mil×5mil-80mil×80mil
(0.13mm*0.13mm-2mm*2mm)

XY分辨率/XY Resolution

0.02mil0.5μm

最大芯片环尺寸/Max. Die Ring Size

6″(152mm)外径(External Diameter)

6.所需设施/Facilities Needed

最大芯片面积尺寸/Max. Die Area

4.7″(119mm)扩张后(Expanded)

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

分辨率/Resolution Ratio

0.04mil  (1μm)

压缩空气/Compressed Air

0.5MPaMIN

顶针Z高度行程/Thimble Z Height Stroke

80mil2mm

额定功率/Rated Power

700W

3.图像识别系统/Image Recognition System

耗气量/Gas Consumption

5L/min

灰阶度/Grey Scale

256级灰度(Level Grey)

7.体积及重量/Volume and Weight

分辨率/Resolution

656×492像素(Pixels)

xx/

Length x Width x Height

140×97×180cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/eight

874kg

 


快速通道
联系我们
产品服务
行业应用
新闻资讯