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GT836M
    发布时间: 2019-06-29 16:00    

GT836M平面式高速固晶机)

周期:180ms

适用于数码、点阵、大功率、COBSMD

一、机型特性


1.平面式LED灯全自动固晶的最佳选择;

2.高速固晶(180ms/颗,每小时产量为20K)、精准的自动化设备为企业提高生产效率、降低成本提供了有效保障,从而切实有效地提高了企业竞争力;

3. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障;

4.采用直驱电机驱动邦头;

5.采用全新接触式探测系统控制摆臂,有效解决了PCB板或支架高度不一致而导致的固晶问题;

6.采用线性电机驱动晶片搜寻平台(X/Y)与固晶平台(B/C

7.采用可程式恒温点胶系统;

8.采用真空漏晶检测;

9. 工控机控制设备运行,简化了自动化设备的操作;


GT836M

Plane-type High-speed Die Bonder

Cycle: 180ms

It is compatible with digital products, dot matrix, high power, COB, and SMD etc.

Product Features

1.        It is the best choice for full-automation die bond of planar LED lights;

2.        High-speed die bond(180ms/piece, 20K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

3.        Precise die bond location and excellent compatibility will guarantee the back-end processing;

4.        Linear motor is applied to drive bond head;

5.        New touch-type deep detection system is applied to control the swing arm, solving the bonding issues caused by the non-uniform height of PCB or holder effectively;

6.        Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

7.        Programmed control constant-temperature adhesive dispensing system is also applied;

8.        Vacuum die missing testing technology is adopted;

9.        IPC will control the operation of equipment, simplifying the operation of automation equipment.


二、规格参数

Specifications and Parameters

 

1.系统功能/System Function

4、吸晶摆臂机械手系统/

Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

180ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶摆臂/Swing Arm of Die Bonder

90°可旋转固晶(Rotatable Die Bond)

XY位置精度/Accuracy

±1.5mil(±0.038mm

吸晶压力/Die Bond Pressure

可调20g250g(Adjustable)

芯片旋转/Die Rotation

±3°

5.送料工作平台/Loading Workbench

2.芯片XY工作台/Die XY Workbench

行程范围/Range of Stroke

155mm*255mm

芯片尺寸/Die Dimensions

4mil×4mil-80mil×80mil
(0.1mm*0.1mm-2mm*2mm)

XY分辨率/XY Resolution

0.02mil0.5μm

最大芯片环尺寸/Max. Die Ring Size

6″(152mm)外径(External Diameter)

6.所需设施/Facilities Needed

最大芯片面积尺寸/Max. Die Area

4.7119mm)扩张后(Expanded)

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

分辨率/Resolution Ratio

0.04mil  (1μm)

压缩空气/Compressed Air

0.5MPaMIN

顶针Z高度行程/Thimble Z Height Stroke

80mil2mm

额定功率/Rated Power

700W

3.图像识别系统/Image Recognition System

耗气量/Gas Consumption

5L/min

灰阶度/Grey Scale

256级灰度(Level Grey)

7.体积及重量/Volume and Weight

分辨率/Resolution

512×512像素(Pixels)

xx/Length x Width x Height

93×93×180cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

630kg

 

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