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HAD310N
    发布时间: 2019-06-29 16:07    



HAD310N

泛用型平面固晶机

周期:200ms

适用于三极管,发射接收管,二极管支架

一、机型特性

1.采用线性电机驱动搜寻晶片平台(X/Y)与送料平台(B/C,确保定位精准度;

2.采用直驱电机驱动邦头;

3.采用真空漏晶检测;

4.采用可程式恒温点胶系统;

5.采用免装料盒上料方式,有效提高了生产效率;

6. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障;

7.工控机控制设备运行,简化了自动化设备的操作;

8.精准的自动化设备为企业提高生产效率,降低成本提供了有效保障,从而切实有效地提高了企业竞争力;

 

HAD310N

Universal Plane-type Die Bonder

Cycle: 200ms

It is compatible with audion, transmitting/receiving tube and diode holders.

Product Features

1.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

2.      Linear motor is applied to drive bond head;

3.      Vacuum die missing testing technology is adopted;

4.      Programmed control constant-temperature adhesive dispensing system is also applied;

5.      Free-loading magazine is applied to improve the production efficiency largely;

6.      Precise die bond location and excellent compatibility will guarantee the back-end processing;

7.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

8.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance your enterprise’s competitiveness.

 

二、规格参数

Specifications and Parameters

                                                                            

1.系统功能/System Function

4、吸晶摆臂机械手系统/

Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

200ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶摆臂/Swing Arm of Die Bonder

90°旋转固晶(Rotatable Die Bond)

XY位置精度/Accuracy

±1.5mil(±0.038mm

吸晶压力/Die Bond Pressure

可调20g250g(Adjustable)

芯片旋转/Die Rotation

±3°

5.适用支架尺寸/Suitable Holder’s Size

2.芯片XY工作台/Die XY Workbench

支架长度/Length

150mm ~ 180mm

芯片尺寸/Die Dimensions

10mil×10mil-100mil×100mil
(0.25mm*0.25mm-2.54mm*2.54mm)

支架宽度/Width

24mm~ 60mm

最大芯片环尺寸/Max. Die Ring Size

8212mm)外径(External Diameter)

6.所需设施/Facilities Needed

最大芯片面积尺寸/Max. Die Area

6.5165mm)扩张后(Expanded)

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

分辨率/Resolution Ratio

0.04mil  (1μm)

压缩空气/Compressed Air

0.5MPaMIN

顶针Z高度行程/Thimble Z Height Stroke

80mil2mm

额定功率/Rated Power

700W

耗气量/Gas Consumption

5L/min

3.图像识别系统/Image Recognition System

7.体积及重量/Volume and Weight

灰阶度/Grey Scale

256级灰度(Level Grey)

分辨率/Resolution

640×480像素(Pixels)

xx高(cm/Length x Width x Height

115×92×200cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

550kg

 

 



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